Modeling And Reliability Characterization Of Area-Array Electronics Subjected To High-G Mechanical Shock Up To 50,000G And Finite Element Analysis Of Package On Package (Pop) Components For Warpage During Reflow
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Modeling And Reliability Characterization Of Area-Array Electronics Subjected To High-G Mechanical Shock Up To 50,000G And Finite Element Analysis Of Package On Package (Pop) Components For Warpage During Reflow